JPH0463639U - - Google Patents
Info
- Publication number
- JPH0463639U JPH0463639U JP1990106217U JP10621790U JPH0463639U JP H0463639 U JPH0463639 U JP H0463639U JP 1990106217 U JP1990106217 U JP 1990106217U JP 10621790 U JP10621790 U JP 10621790U JP H0463639 U JPH0463639 U JP H0463639U
- Authority
- JP
- Japan
- Prior art keywords
- utility
- scope
- registration request
- model registration
- hollow package
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1990106217U JPH0463639U (en]) | 1990-10-08 | 1990-10-08 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1990106217U JPH0463639U (en]) | 1990-10-08 | 1990-10-08 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0463639U true JPH0463639U (en]) | 1992-05-29 |
Family
ID=31852221
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1990106217U Pending JPH0463639U (en]) | 1990-10-08 | 1990-10-08 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0463639U (en]) |
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1990
- 1990-10-08 JP JP1990106217U patent/JPH0463639U/ja active Pending